.6W wide voltage input isolated regulated DC / DC module power supply

.Double row upright (DIP) encapsulation

.Storage temperature: to 40℃ to + 125℃

.Shell: metal shell encapsulation

.Mean time between failures (MTBF) : 3000000 h

.Operating temperature: -40℃~+85℃

.Max Operating temperature: 85℃, relative temperature: 10%~90%

6W wide voltage input isolated regulated DC / DC module power supply.

.Double row upright (DIP) encapsulation

.Storage temperature: to 40℃ to + 125℃

.Shell: metal shell encapsulation

.Mean time between failures (MTBF) : 3000000 h

.Operating temperature: -40℃~+85℃

.Max Operating temperature: 85℃, relative temperature: 10%~90%

.6W wide voltage input isolated stabilized single output DC/DC module power supply

.Double row upright (DIP) encapsulation

.Storage temperature: to 40℃ to + 125℃

.Shell: metal shell encapsulation

.Mean time between failures (MTBF) : 3000000 h

.Operating temperature: -40℃~+85℃

.Max Operating temperature: 85℃, relative temperature: 10%~90%

.3W wide voltage input isolated stabilized single and dual output DC/DC module power supply

.SIP/SMD package

.The isolation voltage: 1500 VDC 

.Storage temperature: to 40 °C to + 125 °C

.Shell: high flame retardant plastic shell (UL94 - where V0)

.Mean time between failures (MTBF) : 3000000 h

.Working temperature: - 40℃ ~~+ 85℃

.Maximum working temperature: 85 ℃, relative humidity: 10% ~ 90%

. Comply with the RoHS directive. Packaging forms: single row into the SIP encapsulation, double row into the DIP, SMD patch form packaging

.Standard size:23.00×9.80×12.60(mm)，21.90×9.00×11.20(mm),Can be customized.

.3W wide voltage input isolated stabilized single and dual output DC/DC module power supply

.SIP/SMD package

.The isolation voltage: 1500 VDC to 3000 VDC

.Storage temperature: to 40 °C to + 125 °C

.Shell: high flame retardant plastic shell (UL94 - where V0)

.Mean time between failures (MTBF) : 3000000 h

.Working temperature: - 40℃ ~~+ 85℃

.Maximum working temperature: 85 ℃, relative humidity: 10% ~ 90%

. Comply with the RoHS directive. Packaging forms: single row into the SIP encapsulation, double row into the DIP, SMD patch form packaging

.Standard size:23.00×9.80×12.60(mm)，21.90×9.00×11.20(mm),Can be customized.