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.SIP/DIP
.Storge temperature: -40℃~+125℃
.Mean Time Between Failures(MTBF):2000000h
.Operating temperature: -40℃~+85℃
.Max Operating temperature: 85℃, relative temperature: 10%~90%
. Input voltage (24 VDC + 5-5%)
.Efficiency is as high as 76%
.Wide working temperature range: to 40 ° C to + 85 ° C
.The isolation voltage 1500 VDC (with "H" said 3000 VDC) 0.5 mA 1 minute
.Double row patch, plug-in, SMD/DIP) encapsulation
.Double row upright (DIP) encapsulation
.Storge temperature: -40℃~+125℃
.Shell: Metal shell package
.Mean Time Between Failures(MTBF):3000000h
.Working temperature: - 40 ℃ ~ + 85 ℃
.Maximum working temperature: 85 ℃, relative humidity: 10% ~ 90%
.Double row of SMD (SMD) packaging
.The isolation voltage: 1500 VDC (with "H" is 3000 VDC) 0. 5 ma 1 minute
.Storage temperature: - 40℃ ~ + 125℃
.Shell: high flame retardant plastic shell (UL 94 - where V0)
.Mean time between failures (MTBF) : 200000 h
.Working temperature:-40℃~+85℃
.The maximum working temperature:85℃。Relative humidity:10%~90%
.Wide voltage 4.75 VDC - 32 VDC input
.Efficiency is as high as 93%
.Shell: high fire retardant plastic casing, metal shell and bare plate encapsulation
.Mean time between failures (MTBF) : 2000000 h
.Working temperature: to 40 ° C to + 85 ° C
.Maximum working temperature: 85 ° C, relative humidity: 10% ~ 90%
.The output voltage accuracy of soil by 2%
.In line with the RoHS directive
.Single upright (SIP) encapsulation
.Double row upright (DIP) encapsulation .SMT assembly (SMD)