.SIP/DIP 

.Storge temperature: -40℃~+125℃

.Mean Time Between Failures(MTBF):2000000h

.Operating temperature: -40℃~+85℃ 

.Max Operating temperature: 85℃, relative temperature: 10%~90%

. Input voltage  (24 VDC + 5-5%)

.Efficiency is as high as 76%

.Wide working temperature range: to 40 ° C to + 85 ° C

.The isolation voltage 1500 VDC (with "H" said 3000 VDC) 0.5 mA 1 minute

.Double row patch, plug-in, SMD/DIP) encapsulation

.Double row upright (DIP) encapsulation

.Storge temperature: -40℃~+125℃

.Shell: Metal shell package

.Mean Time Between Failures(MTBF):3000000h

.Working temperature: - 40 ℃ ~ + 85 ℃

.Maximum working temperature: 85 ℃, relative humidity: 10% ~ 90%

.Double row of SMD (SMD) packaging

.The isolation voltage: 1500 VDC (with "H" is 3000 VDC) 0. 5 ma 1 minute

.Storage temperature: - 40℃ ~ + 125℃

.Shell: high flame retardant plastic shell (UL 94 - where V0)

.Mean time between failures (MTBF) : 200000 h

.Working temperature:-40℃~+85℃

.The maximum working temperature:85℃。Relative humidity:10%~90%

.Wide voltage 4.75 VDC - 32 VDC input

.Efficiency is as high as 93%

.Shell: high fire retardant plastic casing, metal shell and bare plate encapsulation

.Mean time between failures (MTBF) : 2000000 h

.Working temperature: to 40 ° C to + 85 ° C

.Maximum working temperature: 85 ° C, relative humidity: 10% ~ 90%

.The output voltage accuracy of soil by 2%

.In line with the RoHS directive

.Single upright (SIP) encapsulation

.Double row upright (DIP) encapsulation   .SMT assembly (SMD)